To provide a technique which can inexpensively arrange a circuit chip on a circuit board sheet in an easy and simple manner to manufacture a display circuit board having the circuit chip buried therein in an easy and simple manner with a high yield for controlling respective display pixels.
In the method of manufacturing a circuit board by transferring a predetermined number of circuit chips on a circuit board sheet from a circuit chip holder member for holding the circuit chips thereon, locations for transfer of the predetermined number of circuit chips are selectively set for adhesion parts. The circuit board is manufactured by selectively arranging unset adhesion parts on an unset layer of the circuit board sheet and arranging the predetermined number of circuit chips on the surface thereof.
OHIRA KEISUKE
ISHIZUKA RYOHEI
NAKABAYASHI MASAHITO
IZUMI TADASHI
FUKUDA TATSUO
LINTEC CORP