Title:
両面配線回路基板の製造方法および両面配線回路基板
Document Type and Number:
Japanese Patent JP7381323
Kind Code:
B2
Abstract:
A method for manufacturing a wiring circuit board that is a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layer, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.
Inventors:
Shusaku Shibata
Fukushima Ritsuto
Teppei Shinno
Fukushima Ritsuto
Teppei Shinno
Application Number:
JP2019226977A
Publication Date:
November 15, 2023
Filing Date:
December 17, 2019
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H05K3/44; H05K1/05
Domestic Patent References:
| JP2010108576A | ||||
| JP61295691A | ||||
| JP200431731A |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda
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