Title:
METHOD OF MANUFACTURING ELECTRONIC CIRCUIT
Document Type and Number:
Japanese Patent JPH09148715
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To produce a high-resolution electronic circuit, using computer-aided design data in a direct, low-cost and environment-adaptable photoelectrochemical process. SOLUTION: An electroplating soln. 12 is applied to the surface of a p-type semiconductor material such as NiO, the NiO surface 16 covered with the soln. 12 is irradiated with a light beam 20 to photoelectrochemically deposit a metal seed layer with an electronic circuit pattern and the seed layer is more thickly deposited in a plating bath to form a metal circuit trace on the NiO whereby the porosity of the NiO surface 16 is adjustable to optimize the metal circuit adhesion to facilitate holding an image or transferring the circuit. Changing the NiO bias to the plating bath causes an old metal image to be electrically resolved whereby the old image is removed to form a new circuit pattern by the photoelectrochemical deposition. This process is done on a rotating cylinder.
Inventors:
DEI MOOGAN TENKU
RESURII EFU UOOREN JIYUNIA
YAN JIEI CHIYAN
RESURII EFU UOOREN JIYUNIA
YAN JIEI CHIYAN
Application Number:
JP27483996A
Publication Date:
June 06, 1997
Filing Date:
October 17, 1996
Export Citation:
Assignee:
ROCKWELL INTERNATIONAL CORP
International Classes:
C25D5/02; C25D7/12; H05K3/20; H05K3/18; (IPC1-7): H05K3/20; H05K3/18
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)
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