To provide a manufacturing of an electronic device and a method for manufacturing the electronic device, by using a dispersing element of a metallic element and/or a metallic element compound at a temperature range, which is practicable even for a base material of poor thermal resistance, and to provide the electronic device.
This method of manufacturing the electronic device includes the steps of printing or coating the dispersing element of the metallic element and/or a metallic element compound on the surface of a base substance, irradiating the base substance with an electron beam, from the surface of the base substance and/or from the rear surface of it to form the metallic element and/or metallic element compound layer, and developing conductivity, semiconductivity, resistivity, dielectric properties, or other circuit characteristics required for the electronic device. The electronic device manufactured by the method is also provided.
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TATENO HIROYUKI
TAKAYAMA MICHIO
SATO KEIICHI
