To provide a manufacturing method by which ribbon-like chips produced by cutting are hard to be wound around a tool when a metal conductor layer is formed in a patterned resin material with insulation property and it is cut for flattening to form a wiring layer according to the pattern.
A resin layer 13 provided with a recessed part is formed on a substrate 8, and a metal layer 14 is formed on the surface of the resin layer 13 to bury the recessed part. Then, while the substrate 8 is turned, the metal layer 14 is cut and removed at least up to the resin layer 13, and a wiring layer is formed in the recessed part. This wiring layer formation step is repeated to laminate the wiring layer. In the method of manufacturing an electronic part including this step, the recessed part is comprised of first and second recessed parts 9 and 12, wherein the metal layer 14 is embedded in the first recessed part 9 so that it may not overflow the top surface part and in the second recessed part 12 so that it may overflow the top surface.
WADA NORIHIKO
Hiroki Naito
Daisuke Nagano
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