Title:
METHOD FOR MANUFACTURING ELECTROOPTICAL DEVICE, ELECTROOPTICAL DEVICE, AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP3722143
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for an electrooptical device by which fine flaws and cracks formed at an edge and on a cut surface of a substrate can be removed without corroding wires formed in a projection area and a gap of an electrooptical panel formed by sticking a couple of substrate together, the electrooptical device, and electronic equipment.
SOLUTION: After a liquid crystal panel 1' to be used for the electrooptical device is cut to a single-unit size, cut surfaces and edges of a 1st substrate 10 and a 2nd substrate 20 are subjected to wet etching in the state of the single-unit liquid crystal panel 1' before an IC is mounted to eliminate fine flaws and cracks from the cut surfaces and substrate edges. At this time, wiring parts 51 and 71 formed in the projection area 25 are covered with a 1st protection layer 91. Further, a 2nd protection layer 92 is formed even in the gap 3 to cover wires which are formed there.
Inventors:
Murai Hidetoshi
Manabu Hanakawa
Manabu Hanakawa
Application Number:
JP2003411842A
Publication Date:
November 30, 2005
Filing Date:
December 10, 2003
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
G02F1/13; G02F1/1345; G09F9/00; (IPC1-7): G09F9/00; G02F1/13; G02F1/1345
Domestic Patent References:
| JP2001125508A | ||||
| JP8262419A |
Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Masakazu Aoyama
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa
Masatake Shiga
Masakazu Aoyama
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa