Title:
METHOD OF MANUFACTURING HEAT DISSIPATION SUBSTRATE AND METHOD OF MANUFACTURING COMPOSITE SUBSTRATE
Document Type and Number:
Japanese Patent JP2021168376
Kind Code:
A
Abstract:
To provide a method of manufacturing a heat dissipation substrate, capable of increasing a heat conductive rate reduced by a thin wall treatment during the manufacturing process, and provide a method of manufacturing a composite substrate.SOLUTION: A method of manufacturing a heat dissipation substrate of the present disclosure includes the steps for: preparing a composite material containing diamond and a metal; applying a thin wall treatment to the surface of the composite material to form a processed face on the composite material; and heating the composite material by pulse conductive sintering in a state where a pressure less than 50 MPa is applied to the composite material.SELECTED DRAWING: Figure 3A
Inventors:
YAMADA SHOICHI
KIHARA TORA
ICHIKAWA MASATSUGU
KIHARA TORA
ICHIKAWA MASATSUGU
Application Number:
JP2021009002A
Publication Date:
October 21, 2021
Filing Date:
January 22, 2021
Export Citation:
Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H01L23/373; B22F3/14; C22C1/05; C22C26/00; H05K7/20
Attorney, Agent or Firm:
Seiji Okuda
Osamu Kita
Michi Kajitani
Akiko Miyake
Yu Tanaka
Murase Nariyasu
Hiroyuki Takeda
Osamu Kita
Michi Kajitani
Akiko Miyake
Yu Tanaka
Murase Nariyasu
Hiroyuki Takeda