METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT

Title:

METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT

Document Type and Number:

Japanese Patent JP2007073777

Kind Code:

A

Abstract:

To provide a method for manufacturing a laminated electronic component wherein thickness of its adhesive layers is reduced with their sufficient adhesiveness maintained, and its phenomenon of delamination due to formation of the adhesive layers is effectively prevented.

The method for manufacturing a laminated electronic component has processes of: forming an adhesive layer 28 containing a binder resin and a plasticizer on the surface of an electrode layer 12a or a green sheet 10a; forming a green chip by stacking the electrode layer 12a and the green sheet 10a through the adhesive layer 28; and firing the green chip. The adhesive layer 28 is formed by drying a paste film for the adhesive layer which is formed by using a paste for the adhesive layer containing the binder resin, the plasticizer and a solvent, at temperatures exceeding 80°C and not over 160°C.

Inventors:

KAJIYAMA SHOHEI
KARATSU SHINKO
SATO SHIGEKI

Application Number:

JP2005259893A

Publication Date:

March 22, 2007

Filing Date:

September 07, 2005

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TDK CORP

International Classes:

H01G4/30; H01G4/12

Domestic Patent References:

JP2002332472A

2002-11-22

Foreign References:

WO2004061880A1

2004-07-22

Attorney, Agent or Firm:

Hitoshi Maeda
Shingo Nishide
Koichiro Okura
Miki Sato

Previous Patent: THICK-FILM CIRCUIT COMPONENT

Next Patent: METHOD AND DEVICE FOR PICKING UP SEMICONDUCTOR CHIP