To provide a thick-film circuit component by which the problem of breaking of thick-film electrode wires at through-hole steps even in environments where corrosive gas such as sulfide gas or the like exists.
The thick-film circuit component is provided with an insulating substrate 10, the thick-film electrode wires 12 and 13 which are arranged on both sides of the substrate 10, and a connection part which connects the thick-film electrode wires 12 and 13 which are arranged on both sides of the substrate 10 through a through-hole 11 penetrating the substrate 10. The connection has first conductive thick films 12 and 13 constituting the thick-film electrode wires which are arranged on the inner wall of the through-hole 11 and its vicinity on both sides of the substrate 10, and covers 14 and 15 of second conductive thick films which are arranged in such a way that they cover the through-hole 11 and adjacent parts of the first conductive thick films 12 and 13.
Isamu Watanabe
Ryoji Kosugi
Tomohiro Mori
Tetsuya Hirosawa