Title:
METHOD OF MANUFACTURING LENS FOR LIGHT EMITTING DIODE PACKAGE
Document Type and Number:
Japanese Patent JP2010056505
Kind Code:
A
Abstract:
To provide a method of manufacturing a lens for a light emitting diode package, which is capable of reducing a manufacture cost through reduction of material loss and improving productivity through a simple process without requiring additional equipment investment by freely materializing a final lens shape by curing liquid resin in multi-steps.
The method of manufacturing a lens for a light emitting diode package includes the steps of: preparing a substrate 110 mounting a light emitting chip 130; forming a temporarily cured resin covering the light emitting chip 130 on the substrate 110; and curing the temporarily cured resin into a shape of a lens 150b.
Inventors:
KIM HYUNG TAE
JEON YOUNG RO
LEE OK JU
JEON YOUNG RO
LEE OK JU
Application Number:
JP2008269086A
Publication Date:
March 11, 2010
Filing Date:
October 17, 2008
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01L33/48; G02B3/00
Domestic Patent References:
| JP2008066733A | 2008-03-21 | |||
| JP2007005091A | 2007-01-11 | |||
| JP2004532533A | 2004-10-21 | |||
| JP2006269487A | 2006-10-05 |
Attorney, Agent or Firm:
Masao Omura
Jun Takamura
Jun Takamura