Title:
発光素子の製造方法
Document Type and Number:
Japanese Patent JP7223941
Kind Code:
B2
Abstract:
A method for manufacturing a light-emitting element includes: providing a semiconductor stacked body including a first semiconductor layer, an active layer, and a second semiconductor layer, formed in this order on a substrate; exposing a surface of the first semiconductor layer by removing the substrate; and forming a protective film on the surface of the first semiconductor layer by performing steps including: forming a first layer on the surface of the first semiconductor layer by chemical vapor deposition while introducing a source gas to a film formation chamber at a first flow rate, and forming a second layer on the first layer by chemical vapor deposition while introducing a source gas to the film formation chamber at a second flow rate, the second flow rate being less than the first flow rate.
Inventors:
Eiji Muramoto
Application Number:
JP2020210180A
Publication Date:
February 17, 2023
Filing Date:
December 18, 2020
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/44; C23C16/455; H01L21/316
Domestic Patent References:
| JP2005019972A | ||||
| JP2013115402A | ||||
| JP9050990A | ||||
| JP60035521A | ||||
| JP2015138836A |
Foreign References:
| US20130187183 | ||||
| CN108365057A |
Attorney, Agent or Firm:
Hyuga Temple Masahiko
Junichi Kozaki
Uchida Keito
Junichi Kozaki
Uchida Keito
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