METHOD OF MANUFACTURING METALLIC FILM, THIN-FILM DEVICE HAVING THIS METALLIC FILM AND LIQUID CRYSTAL DISPLAY DEVICE HAVING THIS THIN-FILM DEVICE

Japanese Patent JP2002062665

A

To form a taper angle of a metallic film disposed in a thin-film device to a specified gentle angle.

The manufacturing method which is a fine processing method of the metallic film, such as metallic light shielding film, in the thin-film device and is improved in the manufacturing method by a combination of a wet etching and a dry etching method is provided. The sectional shape of a resist film is so formed as to have the previously determined certain specified angle at its both ends. Consequently, the etchant gaseous current in dry etching flows smoothly along the side walls of the resist and therefore the metallic film having the specified gentle taper angle along this flow may be formed. Further, the production efficiency and quality of thin-film device, such as a TFT for the LCD may be greatly improved.

HATTA YOSHIHISA
MATSUMOTO AKINORI
II SHINICHI

JP2000246994A

February 28, 2002

August 16, 2000

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KONINKL PHILIPS ELECTRONICS NV

G02F1/136; G02F1/1368; G03F7/38; H01L21/027; H01L21/28; H01L21/302; H01L21/306; H01L21/3065; H01L21/3213; H01L21/336; G02F1/1335; H01L29/417; H01L29/423; H01L29/45; H01L29/49; H01L29/786; (IPC1-7): G03F7/38; G02F1/1335; G02F1/1368; H01L21/28; H01L21/027; H01L21/3065; H01L21/306; H01L21/3213; H01L29/786; H01L21/336

Susumu Tsugaru (1 person outside)

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