Title:
成形構造体の製造方法
Document Type and Number:
Japanese Patent JP7342668
Kind Code:
B2
Abstract:
To provide a manufacturing method for a molded structure capable of improving an adhesiveness with a bonded body, and a manufacturing method for a molded structure that can realize cost reduction.SOLUTION: A manufacturing method for a molded structure includes: a mat producing step of producing a mat composed of a vegetable fiber layer 11, a high-viscosity resin fiber layer 12, and a low-viscosity resin fiber layer 13 mainly composed of resin having a viscosity lower than that of the resin contained in the high-viscosity resin fiber layer 12, so that the low-viscosity resin fiber layer 13 is arranged on a lower surface layer 10B side; and a pressing step of forming a molded structure by joining a molded body made of resin to a surface layer 10B side of a plate-shaped body on which the low-viscosity resin fiber layer 13 is arranged after producing the plate-shaped body from the mat, while pressing the plate-shaped body with a molding die.SELECTED DRAWING: Figure 6
Inventors:
Yuki Izawa
Application Number:
JP2019219578A
Publication Date:
September 12, 2023
Filing Date:
December 04, 2019
Export Citation:
Assignee:
Toyota Boshoku Co., Ltd.
International Classes:
B29C70/46; B29C31/10; B29C70/12; B29C70/68
Domestic Patent References:
| JP2005206954A | ||||
| JP2017048475A |
Attorney, Agent or Firm:
Patent Attorney Corporation Akatsuki Joint Patent Office