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Patent Searching and Data


Title:
METHOD OF MANUFACTURING MULTILAER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2001257472
Kind Code:
A
Abstract:

To provide a method of manufacturing a multilayer printed board using a conductive paste for an interlayer connection by which the difference in alignment between a blind interlayer connection hole and a through interlayer connection hole is extremely small.

Through holes 24, 25 for correcting and checking a position are made near the inner via holes 20, 21 for correcting and checking the position when a through hole is made. The holes 24, 25 are made in an adhesive sheet for the interlayer insulation and are filled with a conductive paste, with the desired position of a four-layer copper-plated laminated board having inner layer conductive circuits 11, 12 positioned at an origin. The position relation between the through holes 24, 25 for correction and checking a position, and the inner via holes 20, 21 for correcting and checking the position on completion of a through hole which are made in the adhesive sheet 16 for the interlayer insulation and are filled with the conductive paste, can be checked by the use of a X-ray passing position checking apparatus or a method of spot-facing a copper foil placed to the adhesive sheet 16 for the interlayer insulation and then visually checking the position.


Inventors:
Oishi, Kazuya
Application Number:
JP2001000047873
Publication Date:
September 21, 2001
Filing Date:
June 19, 1998
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
岩橋 文雄 (外2名)