To provide a method of manufacturing a multilayer printed board using a conductive paste for an interlayer connection by which the difference in alignment between a blind interlayer connection hole and a through interlayer connection hole is extremely small.

Through holes 24, 25 for correcting and checking a position are made near the inner via holes 20, 21 for correcting and checking the position when a through hole is made. The holes 24, 25 are made in an adhesive sheet for the interlayer insulation and are filled with a conductive paste, with the desired position of a four-layer copper-plated laminated board having inner layer conductive circuits 11, 12 positioned at an origin. The position relation between the through holes 24, 25 for correction and checking a position, and the inner via holes 20, 21 for correcting and checking the position on completion of a through hole which are made in the adhesive sheet 16 for the interlayer insulation and are filled with the conductive paste, can be checked by the use of a X-ray passing position checking apparatus or a method of spot-facing a copper foil placed to the adhesive sheet 16 for the interlayer insulation and then visually checking the position.