To provide a method with improved mass-production property for manufacturing a multilayer printed wiring board with electronic parts mounting holes and a through hole, by opening the hole for keeping electronic parts without cutting and machining the substrate of an outermost layer.

In a method, a lamination body 10 is formed while a hole 2 for keeping electronic parts is being formed, a lid body 7 for covering the opening end face of the hole 2 for mounting electronic parts and an adhesive member 4 for surrounding the outer periphery of the lid body 7 are arranged on the surface of the lamination body 10, a copper foil is arranged, laminated, and adhered for forming a multilayer board, a through hole is formed, an outer- layer circuit is formed, the lid 7 is eliminated and the hole 2 for mounting electronic parts is opened, and a conductor circuit 5 in the hole 2 for mounting electronic parts is placed. In this case, the lid body 7 has a step while it consists of a small part 15 and a large part 16, the small part 15 is engaged to the hole 2 for mounting electronic parts, and the large part 16 is brought into contact with the surface of the lamination body 10 around the hole 2 for mounting electronic parts.