To provide a method of manufacturing a power module or the like capable of stably manufacturing a power module with high characteristic reliability.
The method of manufacturing the power module is for manufacturing the power module 1 by laminating a cooler 5, an insulating resin sheet 4, a heat dissipation block 3 and a semiconductor chip 2. First, the insulating resin sheet 4 is interposed between the cooler 5 and the heat dissipation block 3, and the cooler 5 and the heat dissipation block 3 are thermocompression-bonded with each other. Then, the semiconductor chip 2 is solder-bonded on the heat dissipation block 3. Thus, while preventing the breakage of the semiconductor chip 2 by pressurization, the adhesion defect of the adhesive interface 4a of the cooler 5 and the insulating resin sheet 4 and the adhesive interface 4b of the insulating resin sheet 4 and the heat dissipation block 3 is prevented.
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Sekiya Mitsuo
Takumi Ito