To provide a method for manufacturing a seed plate for electrolytic refining, by which the spring back value of the seed plate can be maintained at a desired fixed value.
The relation between the supply amount of an electrolyte solution being supplied to an electrolytic cell and the spring back value of the seed plate is previously searched, and then the supply amount of the electrolyte solution is adjusted so that the desired spring back value is obtained. When an electrolyte solution containing copper in a concentration of 475 g/L, sulfuric acid in a concentration of 18030 g/L, glue in an amount of 12060 g per 1 ton of deposition copper, Apitong in an amount of 3015 g per 1 ton of deposition copper, and thiourea in an amount of 6030 g per 1 ton of deposition copper is used, and when the supply amount of the electrolyte solution is defined as x (L/min) and the spring back value is defined as y, the relation is shown by formula: y = 1.24x +(215).
NAKANO OSAMU
MATSUBARA SATOSHI
| JP2003293182A | 2003-10-15 | |||
| JP2001164392A | 2001-06-19 | |||
| JP2003073879A | 2003-03-12 |