Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3536070
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a semiconductor device for rapidly and surely transferring conductive particles to the device.
SOLUTION: The apparatus for manufacturing the semiconductor device comprises a container for housing the conductive particles, an agitating means for agitating the particles in the container with an air or an inert gas flow, and a mounting jig for the particles. Accordingly, since the particles are supplied by using the air or inert gas flow, the particles can be supplied at a high speed. Since a mechanical force is not applied to the particles, damages to the particles can be prevented.
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Inventors:
Odajima, Hitoshi
Hasegawa, Hiroshi
Kawarada, Masayuki
Fukazawa, Hideyuki
Hasegawa, Hiroshi
Kawarada, Masayuki
Fukazawa, Hideyuki
Application Number:
JP2002026237A
Publication Date:
June 07, 2004
Filing Date:
January 31, 1990
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
作田 康夫