Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE BY ADOPTING LARGE-SCALED PANEL SIZE
Document Type and Number:
Japanese Patent JP2009027127
Kind Code:
A
Abstract:
To provide a means for efficiently performing rewriting on a thin semiconductor chip.
Individual piece-sized chips 406 are arrayed, in a state such that the active faces of those IC chips 406 are faced to a mending tool, the back faces and side faces of the chips 406 are sealed with resin, and the IC chips 406 are grounded to prescribed thickness so as to be made small, and attached to a substrate 520, and the mending tool is peeled. Afterwards, the substrate face of a plurality of units is attached to a pedestal, and rewiring 730, insulating layers 720 and solder balls 740 are formed on the active faces of the chips, and the pedestal is peeled so that individual semiconductors can be manufactured by dicing.
Inventors:
YANG WEN-KUN
LIN CHIH-WEI
YU CHUN-HUI
LIN CHIH-WEI
YU CHUN-HUI
Application Number:
JP2008002871A
Publication Date:
February 05, 2009
Filing Date:
January 10, 2008
Export Citation:
Assignee:
ADVANCED CHIP ENG TECH INC
International Classes:
H01L23/12
Attorney, Agent or Firm:
▲吉▼川 俊雄
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