To relieve thermal stresses transmitted from a base to a sensor chip by securing the thickness of an adhesive without using any bead in a method of manufacturing a physical quantity sensor in which the sensor chip is mounted on the base through the adhesive.
In the method of manufacturing the physical quantity sensor, a deformation of the adhesive 16 caused by the own weights of the sensor chip 11 and a glass pedestal 13 can be prevented, because the chip 11 and the pedestal 13 are mounted on the adhesive 16 after the adhesive 16 is semi-cured by heating. Therefore, the volume of the adhesive 16 can be increased by increasing the thickness of the adhesive 16. Consequently, when a thermal stress is generated in the dynamical quantity sensor due to a temperature change, the fluctuation of the characteristics of the sensor can be prevented, because thermal stress transmitted from a packaging material 15 to the sensor chip 11 can be relieved by the adhesive 16 increased in thickness.
IKEZAWA TOSHIYA
SAITO TAKASHIGE
