To obtain, in high yield, highly dispersive silver particle powder suitable for use in fine wiring formation and having excellent low temperature sinterability.

In this method for manufacturing the silver particle powder having excellent dispersibility into a low-polarity liquid organic medium, a silver compound is subjected, in alcohol having 80 to 200°C boiling point or polyol having 150 to 300°C boiling point, to reduction treatment at 80 to 200°C under reflux while maintaining a flow in which Reynolds number does not exceed 3.70×104. The flow in which Reynolds number does not exceed 3.70×104 can be maintained under agitation at an agitation power of ≤5.68×108 W.