To provide a method of manufacturing a solder sheet containing metal particles having few vacant holes remained.

The method of manufacturing the solder sheet containing the metal particles B includes: an arrangement step for disposing the metal particles with a melting point higher than that of the solder between a first sheet S1 and a second sheet S2 mainly composed of solder; and a pressure bonding step for pressure-bonding the first sheet and the second sheet in a reduced pressure atmosphere after the arrangement step. Preferably, the pressure bonding step includes an oxide removing step for removing the oxides of the pressure bonding surface of the first sheet and/or the second sheet before the first sheet and the second sheet are press-bonded.