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Patent Searching and Data


Title:
METHOD OF JOINING TWO MEMBERS AND JOINED BODY BY THIS METHOD
Document Type and Number:
Japanese Patent JP2010179313
Kind Code:
A
Abstract:

To provide a method of joining two members so that the thickness of the joined layer is substantially uniform using solder or a filler metal and the like, and also to provide a joined body having a substantially uniform thickness of the joined layer using a joining material such as the solder or the filler metal and the like.

The method of joining a first member 10 and a second member 20 is characterized in that, on the first member 10, a first joining material, a cell structure having a plurality of cells, and a second joining material are laminated in order, and the second member 20 is arranged on the second joining material, and then joining is performed under pressurization.


Inventors:
HIRANO TOMOSUKE
HANAMACHI TOSHIHIKO
Application Number:
JP2009022273A
Publication Date:
August 19, 2010
Filing Date:
February 03, 2009
Export Citation:
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Assignee:
NHK SPRING CO LTD
International Classes:
B23K1/00; B23K1/14; B23K1/19; C04B37/02
Domestic Patent References:
JPS59162185A1984-09-13
JP2004174522A2004-06-24
JPS5362270U1978-05-26
JPS4714210A
Attorney, Agent or Firm:
Takahashi Hayashi & Partners