Title:
振動デバイスの製造方法
Document Type and Number:
Japanese Patent JP7423963
Kind Code:
B2
Abstract:
To provide a method for manufacturing a vibration device that can prevent a reduction in reliability of an integrated circuit due to thermal damage.SOLUTION: A method for manufacturing a vibration device includes: a hole forming step of forming, on a semiconductor substrate having a first surface and a second surface in a front-back relation, a hole that opens in the first surface; an insulating film forming step of forming an insulating film on an inner surface of the hole; a through electrode forming step of charging a conductive material in the hole to form a through electrode; an integrated circuit forming step of, after the through electrode forming step, forming an integrated circuit on the first surface of the semiconductor substrate; a vibration piece arrangement step of arranging a vibration piece on the semiconductor substrate; and a lid joining step of joining a lid that covers the vibration piece to the semiconductor substrate.SELECTED DRAWING: Figure 1
Inventors:
Koichi Mizugaki
Application Number:
JP2019179270A
Publication Date:
January 30, 2024
Filing Date:
September 30, 2019
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H03H3/02; H03B5/32; H03H9/02
Domestic Patent References:
| JP2007019310A | ||||
| JP2014138118A | ||||
| JP2014086963A | ||||
| JP2008109636A | ||||
| JP2017139717A | ||||
| JP2010273362A |
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi
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