Title:
METHOD FOR MANUFACTURING WAVEGUIDE SUBSTRATE
Document Type and Number:
Japanese Patent JP2017011672
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a waveguide substrate capable of securing the film thickness of a metal film near a bottom of a non-through hole and preventing peeling of the metal film formed on a surface of the substrate.SOLUTION: A method for manufacturing a waveguide substrate comprises: a first metal film forming step of forming a first metal film on one principal surface of the substrate in which a non-through hole is formed and an inner wall of the non-through hole by a sputtering method; a resist forming step of forming a resist on one principal surface side of the substrate so as to block an opening of the non-through hole; a metal film removing step of removing the first metal film formed on the one principal surface; a resist removing step of removing the resist; and a second metal film forming step of forming a second metal film on the one principal surface of the substrate by the sputtering method in a state in which the first metal film is formed on the inner wall of the non-through hole.SELECTED DRAWING: Figure 1
Inventors:
HAN OUCK
Application Number:
JP2015247607A
Publication Date:
January 12, 2017
Filing Date:
December 18, 2015
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H01P11/00; H01L23/12; H01L23/15; H01P3/12; H01P5/107; H05K3/00
Domestic Patent References:
| JP2015076836A | 2015-04-20 | |||
| JP2014236291A | 2014-12-15 | |||
| JP2014158243A | 2014-08-28 | |||
| JP2010147145A | 2010-07-01 | |||
| JP2007520051A | 2007-07-19 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark