Title:
METHOD OF MANUFACTURING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD SHEET
Document Type and Number:
Japanese Patent JP2021101448
Kind Code:
A
Abstract:
To provide a wiring circuit board capable of accurately measuring alignment errors of masks and a manufacturing method thereof.SOLUTION: A method of manufacturing a wiring circuit board includes the following steps: forming a conductor pattern 5, where photo resist 49 is exposed plural times in a state where a forth mask 39 including a forth shielding mark 43 and a fifth mask 40 including a sixth shielding mark 46 are disposed in a longitudinal direction in this order, the photo resist 49 is developed to form plating resist 51, and plating is performed using the plating resist 51; exposing the plating resist 51, where on the photo resist 49, a portion that was a facing portion 55 on the fourth mask 39 at the time of the first exposure and a portion that mounted the fifth mask 40 at the time of the second exposure are overlapped. By the first time exposure of the photo resist 49 through the forth shielding mark 43 and the plating using the plating resist 51, a first conductive mark 25 is formed. By the second time exposure of the photo resist 49 through the fifth mask 40 and the plating using the plating resist 51, a third conductor mark 27 is formed.SELECTED DRAWING: Figure 10
Inventors:
MINATOYA TAKAHIRO
TAKANO TAKAHIRO
YAMAJI MASATAKA
TAKANO TAKAHIRO
YAMAJI MASATAKA
Application Number:
JP2019232710A
Publication Date:
July 08, 2021
Filing Date:
December 24, 2019
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H05K3/00; G03F9/00; H05K3/06; H05K3/18
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda