Title:
METHOD OF MATCHING SEMICONDUCTOR WIRE BONDS
Document Type and Number:
Japanese Patent JPS549580
Kind Code:
A
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Inventors:
KONNO TOMOJI
HAMADA KUNIAKI
HAMADA KUNIAKI
Application Number:
JP7452377A
Publication Date:
January 24, 1979
Filing Date:
June 24, 1977
Export Citation:
Assignee:
KAIJO DENKI KK
International Classes:
G05D3/12; G05D3/00; H01L21/60; H01L21/68; (IPC1-7): G05D3/00; H01L21/60; H01L21/68
Next Patent: JPS549581