PURPOSE: To curtail the process, to shorten the working time, and to prevent damages of chip components by inserting chip components in through-holes coated with cream solder and by soldering them on each one side in a solder bath.

CONSTITUTION: A through-hole 2 bored through a printed board 1 is coated with cream solder 4, where a chip component 3 is inserted and temporarily fixed by the cream solder 4. The next step is to electrically connect an electrode 5a formed on the component mounting surface 5 to one end electrode 3a of the chip component 3 by soldering in a solder bath. The further step is to electrically connect an electrode 6a formed on the solder surface 6 of the printed board 1 to the other end electrode 3b of the chip component 3 by inversion of the printed board 1 and by resoldering in a solder bath. This method can curtail the process, shorten the working time, and prevent damages of chip components.