To provide a method for mounting an optical component capable of reducing a wiring loss at a high-speed signal transmission time, by eliminating a wiring difference of a height direction between components to be wire bonded, thereby reducing an inductance due to the wirings.

The method for mounting an optical component comprises the steps of forming containing holes 11 to 14 of a depth equal to a thickness of each component on a mounting board 6 for fixing the component, in order to align the heights of the mounting surfaces for taking out the wirings of the component such as a photodiode 1, a preamplifier IC 2, a chip capacitor 3, a chip resistor 4 or the like; fixing a height regulating pedestal 21 for aligning the heights of the respective components on the board 6 for mounting or fixing the components in the holes; and mounting the components thereon, thereby aligning the heights of the mounting surfaces of the respective components.