To provide a method which picks up and collects semiconductor wafer fragments when exfoliating the semiconductor wafer fragments by heat from a heat-peelable pressure-sensitive adhesive sheet having a thermal expansion layer containing thermally expandable microspheres, and can easily perform peeling, picking up and collecting desired one of a plurality of the semiconductor wafer fragments while keeping others on the adhesive sheet.
The method for picking up and collecting the semiconductor wafer fragments includes steps of heating some of the plurality of the semiconductor wafer fragments adhered on the heat-peelable pressure-sensitive adhesive sheet by a heating method for heating the adhesive sheet partially so that the heated portion of the adhesive layer is expanded; selectively peeling the semiconductor wafer fragments; and picking up and collecting those by an absorption nozzle wherein the heat-peelable pressure-sensitive adhesive sheet acts as a layer for adhering the semiconductor wafer on one side of a support base and has the thermal expansion adhesive layer containing thermally expandable microspheres.
| WO/2009/072538 | PROTECTIVE FILM FOR LASER PROCESSING AND PROCESSING METHOD USING THE SAME |
| JP2008066336 | SHEET FOR MACHINING WAFER |
| JP3166742 | DICING DEVICE |
KAWANISHI MICHIO
ARIMITSU YUKIO
| JPH113875A | 1999-01-06 | |||
| JP2000248240A | 2000-09-12 | |||
| JPH04201237A | 1992-07-22 | |||
| JPS6136777A | 1986-02-21 |
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