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Title:
METHOD OF PREVENTING OR REDUCING ELUTION OF ALKALI METAL ON SURFACE OF SUBSTRATE
Document Type and Number:
Japanese Patent JP2012240851
Kind Code:
A
Abstract:

To provide a substrate at a low cost that can prevent or reduce elution of an alkali metal on the surface of the substrate for a long period, and resultantly to make it possible to suppress formation of an alkali metal compound on the surface of the substrate to maintain sensuousness such as transparency, to suppress degradation or improve a visible light transmittance, and not to influence electronic controllability even when used for an optical and electronic apparatus such as a display.

In a method of preventing or reducing elution of an alkali metal on the surface of a substrate, a positive charge material, or a positive charge material and a negative charge material are disposed on the surface or in the surface layer of the substrate containing the alkali metal.


Inventors:
OGATA SHIRO
MATSUI YOSHIMITSU
Application Number:
JP2011108753A
Publication Date:
December 10, 2012
Filing Date:
May 13, 2011
Export Citation:
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Assignee:
SUSTAINABLE TITANIA TECH INC
International Classes:
C03C17/25; B05D7/00
Domestic Patent References:
JPS5826051A1983-02-16
JPS5826052A1983-02-16
JP2006206400A2006-08-10
JP2009209319A2009-09-17
JPWO2009008419A12010-09-09
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama



 
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