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Title:
METHOD OF PROCESSING PYROELECTRIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2001068748
Kind Code:
A
Abstract:

To stabilize the detection characteristic of a pyroelectric sensor by irradiating a cut portion or the facet of an opening for processing with a laser beam in such a manner that the composition of a pyroelectric substrate is improved.

A thin platelike pyroelectric substrate 1 is processed with a laser beam 6 to provide a cut portion or an opening. That is, a cut portion 2 or a facet 5 of an opening of the substrate 1 is irradiated with a laser beam 6 in such a manner that the composition of the substrate 1 is modified. As a result of this processing, a slit or a through hole as the portion 2 or the opening is formed, and the processed facet 5 of the substrate 1 is heated to a prescribed temperature by the beam 6 to have its quality modified.


Inventors:
NISHIMURA MAKOTO
MIYAGAWA NOBUYUKI
KAWASHIMA MASAHITO
Application Number:
JP23827599A
Publication Date:
March 16, 2001
Filing Date:
August 25, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B23K26/352; H01L37/02; H01L41/22; H01L41/335; (IPC1-7): H01L37/02; B23K26/00; H01L41/22
Attorney, Agent or Firm:
Junji Ando (1 person outside)