Title:
METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JP2000288911
Kind Code:
A
Abstract:
To provide a polishing device or a polishing pad capable of efficiently making uniform and clean the full surface of a semiconductor substrate by polishing the surface of a photoresist or an organic insulating film formed on the semiconductor substrate.
The polishing device of a semiconductor substrate is provided, wherein the semiconductor substrate is fixed to a polishing head, and while a polishing pad made of a poly (allylenesulfido) high-density fiber fixed to a polshing surface plate is pressed to the semiconductor substrate, the polishing head, the polishing surface plate or both are rotated to polish the semiconductor substrate.
Inventors:
JIYOU KUNITAKA
ICHIJO TSUTOMU
ICHIJO TSUTOMU
Application Number:
JP10230999A
Publication Date:
October 17, 2000
Filing Date:
April 09, 1999
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
B24B37/20; B24B37/24; H01L21/304; (IPC1-7): B24B37/00; H01L21/304