Title:
METHOD OF PROCESSING SUBSTRATE
Document Type and Number:
Japanese Patent JP2004103864
Kind Code:
A
Abstract:
To provide a method of processing a substrate which prevents contamination on a device face when drying when the device face of the substrate is dried after being processed with a processing liquid.
The method of processing the substrate processes the substrate while rotating it by means of a rotating table 11. The method of processing the substrate comprises processes of holding the substrate on the rotating table with the device face formed with a circuit pattern faced down, processing the substrate while supplying the processing liquid to the device face by turning the rotating table, and drying the substrate by rotating it at a higher speed than when processing it with the processing liquid.
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Inventors:
AIKAWA KEITA
Application Number:
JP2002264290A
Publication Date:
April 02, 2004
Filing Date:
September 10, 2002
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP
International Classes:
F26B5/08; F26B11/18; H01L21/205; H01L21/304; H01L21/306; (IPC1-7): H01L21/304; F26B5/08; F26B11/18; H01L21/205; H01L21/306
Attorney, Agent or Firm:
Takehiko Suzue
Sadao Muramatsu
Atsushi Tsuboi
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai
Sadao Muramatsu
Atsushi Tsuboi
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai
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