Title:
METHOD FOR PRODUCING ALKALI-SOLUBLE RESIN, AND PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023028821
Kind Code:
A
Abstract:
To provide a production method for stably obtaining a specific side-chain double bond-containing alkali-soluble resin obtained by esterification reaction between an acid group and an epoxy group, and a photosensitive resin composition which can be formed into a cured product having good exposure sensitivity and good solvent resistance under a low temperature curing condition.SOLUTION: There is provided a method for producing an alkali-soluble resin that has an ethylenically unsaturated double bond and has a double bond equivalent of 350 g/mol or less in a side chain, wherein in a step in which esterification reaction is performed between an acid group and an epoxy group, specific temperature control is performed. There is also provided a photosensitive resin composition which includes: an alkali-soluble resin which has a (meth)acrylate skeleton in a main chain and an ethylenically unsaturated double bond in a side chain and has a double bond equivalent of 350 g/mol or less; a polyfunctional monomer and a photopolymerization initiator. A method for producing a cured product is furthermore provided which includes a step of curing the photosensitive resin composition at a temperature of 150°C or lower.SELECTED DRAWING: None
Inventors:
TERADA TAKUMA
MATSUURA HIROKI
MATSUURA HIROKI
Application Number:
JP2021134747A
Publication Date:
March 03, 2023
Filing Date:
August 20, 2021
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
C08F2/50; C08F8/00; C08F290/12; G03F7/031; G03F7/038