To improve workability and productivity in production of an article formed by using an epoxy resin composition.
The method for producing the article formed by using an epoxy resin composition containing an epoxy resin and a curing agent comprises a step for keeping the epoxy resin composition in B-stage state, a step for orientating molecular chain of an epoxy resin in the composition by keeping the epoxy resin composition in B-stage state in a liquid state by heating and then applying either one of magnetic field, electric field and shearing field thereto and a step for perfectly curing the epoxy resin composition in the B-stage state while keeping the orientation state. The such article includes an epoxy resin molded product formed by using the epoxy resin composition, an epoxy resin composite molded product or a printed circuit board formed by using the composite molded product.
SHIMOYAMA NAOYUKI
KIMURA TORU
JP2000281995A | 2000-10-10 | |||
JPS63111038A | 1988-05-16 | |||
JP2004256687A | 2004-09-16 | |||
JP2004259949A | 2004-09-16 | |||
JP2004175926A | 2004-06-24 | |||
JP2004225034A | 2004-08-12 | |||
JP2004331811A | 2004-11-25 |
Makoto Onda
Next Patent: WATER-BASED MOISTUREPROOFING AND INSULATING COATING AGENT