To provide a method for producing a ceramic multilayer wiring board in which high frequency characteristics can be enhanced by suppressing interlayer shift of the wiring pattern of each ceramic green sheet.

The method for producing a ceramic multilayer wiring board comprises first step for boring a plurality of print positioning/reading recognition parts 12 through a ceramic green sheet 11 of lowermost layer, second step for detecting a print position by image processing with reference to the recognition parts 12 and printing a wiring pattern 13 on the ceramic green sheet 11, third step for temporarily bonding a next layer ceramic green sheet 14 having windows 16 larger than the recognition parts 12 at positions corresponding to the recognition parts 12, and fourth step for detecting a print position by image processing with reference to the recognition parts 12 through the window 16 and printing a wiring pattern 17 on the next layer ceramic green sheet 14 wherein the wiring pattern is printed on a required number of ceramic green sheets by repeating the third and fourth steps.