To provide a multilayer circuit board in which the problem of stripping or disconnecting a metal wiring is eliminated, and a method for producing such a multilayer circuit board through a convenient process.

The multilayer circuit board 26 comprises a circuit board 28, and an insulation layer 30, and a metal wiring layer 31 formed sequentially thereon. A wiring pattern formed on the metal wiring layer 31 and a wiring pattern 27 formed on the circuit board 28 are interconnected electrically through via holes 36 made through the metal wiring layer 31, the insulation layer 30 and the circuit board 28. The wiring pattern of the metal wiring layer 31 comprises a first wiring pattern 32 having a high adhesion strength to the insulation layer 30, and a second wiring pattern 34 having an adhesion strength to the insulation layer 30 lower than that of the first wiring pattern 32 and finer than the first wiring pattern 32. The first wiring pattern 32 is formed of a copper foil 40 having a roughened contact face applied tightly to the insulation layer 30 by hot press, and the second wiring pattern 34 is formed of a metal film 46 plated onto the insulation layer 30.