To provide a copper foil for a printed electric circuit board, which has a sufficient adhesive force (strength) with a synthetic resin substrate even when the copper foil has a very low fine roughened surface, does not cause peeling off of a powder (powder peeling off) in an etching treatment, is favorable in an electrolytic solution for a roughening treatment, wastewater treatment after electrolysis or the like, and is environmentally friendly.
The copper foil is obtained by previously cleaning the surface of a copper foil with an acidic cleaning solution formed from copper sulfate, and then charging the cleaned copper foil into an acidic copper sulfate electrolytic bath containing a metal ion compound formed of a trace amount of sodium phosphotungstate and plating the surface of the copper foil to form a roughened layer, further forming the heat resistant Zn alloy layer and rust-preventive layer of known technology on the roughened layer, and finally, applying an alkylsilicate on the rust-preventive layer.
TSAO PI-YAUNG
HUANG CHIN-CHEN
| JP2005248323A | 2005-09-15 | |||
| JP2011219790A | 2011-11-04 | |||
| JP2005290423A | 2005-10-20 | |||
| JP2011009267A | 2011-01-13 | |||
| JP2007501330A | 2007-01-25 |
Masakazu Takahashi
Tomokazu Takahashi
Next Patent: ALUMINUM ALLOY WIRE FOR BOLT, THE BOLT AND METHODS FOR MANUFACTURING THE SAME