To provide a method for producing a multilayer copper-clad laminated sheet that prevents warpage, variation of its dimensional accuracy by uniform dimensional shrinkage, and deformation (distortion) of the multilayer copper-clad laminated sheet.

The multilayer copper-clad laminated sheet includes an inner layer circuit board in which a circuit has been formed in advance, an outer layer plate or copper foil, and a prepreg. The method of producing the multilayer copper-clad laminated sheet includes the steps of: superposing the inner layer circuit board with the circuit formed thereon on the outer layer plate or the copper foil through the prepreg to form a laminate; alternately laminating the laminates and metal plates to an allowable height in a press stage; heat-pressing the laminates by a press and bonding them to form a multilayer copper-clad laminated sheet; and immediately after the heat-pressing, extracting the multilayer copper-clad laminated sheet and the metal plates from the inside of the press stage while being alternately laminated, and leaving them to cool down.