To provide a method of manufacturing a wiring board offering efficient operations of peeling and collecting a protective film as well as preventing a lowered yield.

The method of manufacturing a build-up multilayer resin wiring board includes a tape-applying process S2 and a peeling process S3. In the tape-applying process S2, two sheets of substrates are supported to be adjoined under the condition that the edges thereof are placed close to each other, and a tape is applied so as to join the protective films to each other at the edges of the substrates. In the peeling process S3, the protective films joined to each other are successively peeled off by sequentially lifting them up via the tape so that an interlayer insulating material may be left on the substrate.