To separate and recover metal Cu powder and metal Al powder, at almost no mutual mixing with each other, from waste materials containing metal Al, metal Cu, glass, and organic substance such as those usually obtained by cutting a copper-coated glass epoxy printed circuit board using an Al-coated backup board, utilizing only cheap chemicals such as NaOH, HCl, CaCO3 harmless to the surrounding environment.

The waste material recycling method comprises dry-distillating and crushing waste materials at first, and then putting them in water so as to float Al and glass using NaOH, followed by adding HCl to such floating materials which separates sediment therein into Cu powder and C powder by virtue of an upward flow, thereby precipitating the glass and floating Al, and then performing neutralization with CaCO3 so as to recover the desired substances.