Title:
METHOD OF REDUCING UNDULATION ON WAFER SURFACE AND DEVICE THEREOF
Document Type and Number:
Japanese Patent JP2014042956
Kind Code:
A
Abstract:
To positively reduce surface waviness of a wafer after the cutting, by using a wire with the bonded abrasive of a wire saw.
A wire saw 2 is provided for cutting a semiconductor ingot 6 as a large number of wafers, by feeding and moving the semiconductor ingot 6 in the cut direction to a row of wire 3 with bonded abrasives. In a process for extracting the wafers from the wire row of the wire 3 with the bonded abrasives after completion of cutting the wafers, a top portion of waviness of the wafer surface is scraped off by providing a relative rocking motion between the wafers and the wire 3 with the bonded abrasives, while providing a traveling motion to the wire 3 with the bonded abrasives.
Inventors:
TAMAKI KOJI
KAWAZU TOMOYUKI
TANIZAKI HIROSHI
KAWAZU TOMOYUKI
TANIZAKI HIROSHI
Application Number:
JP2012186301A
Publication Date:
March 13, 2014
Filing Date:
August 27, 2012
Export Citation:
Assignee:
KOMATSU NTC LTD
International Classes:
B24B27/06; B24B47/20; B28D5/04
Domestic Patent References:
| JP2008229752A | 2008-10-02 | |||
| JPH10337725A | 1998-12-22 | |||
| JP2008142842A | 2008-06-26 | |||
| JP2008229752A | 2008-10-02 |
Attorney, Agent or Firm:
Kunio Nakagawa
Takashi Nakagawa
Takashi Nakagawa
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