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Patent Searching and Data


Title:
METHOD FOR RELEASING BACK COATING LAYER
Document Type and Number:
Japanese Patent JP2002256177
Kind Code:
A
Abstract:

To provide a method capable of completely releasing and removing a back coating layer having easy slipperiness and easy releasability without leaving any trace amount of the residue behind on a film having surface smoothness on both sides thereof.

The method for releasing a back coating layer which is formed from a resin composition having easy slipperiness and easy releasability and which is coated on the back of a film having surface smoothness on both sides thereof comprises dry laminating a synthetic resin film on the back coating layer and releasing the synthetic resin film to thereby release the back coating layer from the film having surface smoothness on both sides thereof together with the synthetic resin film dry laminated on the back coating layer, or alternatively laminating a pressure sensitive adhesive film with a high adhesive strength on the back coating layer and releasing the pressure sensitive adhesive film with a high adhesive strength to thereby release the back coating layer from the film having surface smoothness on both sides thereof together with the pressure sensitive adhesive film laminated on the back coating layer.


Inventors:
KASHIWAGI TETSUYA
OSAKA MINORU
SUMOTO MISAO
Application Number:
JP2001376643A
Publication Date:
September 11, 2002
Filing Date:
December 11, 2001
Export Citation:
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Assignee:
TOBI CO LTD
International Classes:
C09D9/00; (IPC1-7): C09D9/00
Attorney, Agent or Firm:
Toshio Nishizawa