Title:
METHOD FOR REMOVING UNLEADED SOLDER FROM SLIDER PAD AND MAGNETIC DISK DEVICE
Document Type and Number:
Japanese Patent JP2006026692
Kind Code:
A
Abstract:
To provide a method for removing unleaded solder from a slider pad for the purpose of reutilizing a head/slider used in a magnetic disk device.
A slider pad 104 installed in the head/slider 103 and a lead pad 235 are connected by a solder fillet 237 of unleaded solder. A cutting tool 309 is preheated near the melting point of the unleaded solder. The cutting tool 309 is moved parallel with the face of the slider pad 104, with the solder fillet cut while it is softened. In a reusable state of the head/slider 103 without imparting stress to the slider pad 104, the solder fillet is removed.
Inventors:
SATO TAKUYA
YOSHIDA TATSUSHI
HASHI NOBUYUKI
MATSUMOTO YUSUKE
YOSHIDA TATSUSHI
HASHI NOBUYUKI
MATSUMOTO YUSUKE
Application Number:
JP2004209508A
Publication Date:
February 02, 2006
Filing Date:
July 16, 2004
Export Citation:
Assignee:
HITACHI GLOBAL STORAGE TECH
International Classes:
B23K1/018; G11B5/60; G11B21/21
Attorney, Agent or Firm:
Hiromichi Watanabe
Kazuo Moriya
Kazuo Moriya