Title:
METHOD OF SEALING CIRCUIT BOARD, CASE FOR SEALING CIRCUIT BOARD AND RESIN SEALING CIRCUIT
Document Type and Number:
Japanese Patent JP3305601
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide the sealing method of a circuit board capable of sealing the circuit board by a small quantity of sealing resins, a case for sealing the circuit board and a resin sealing circuit.
SOLUTION: A bag 4 is formed of a heat-shrinkable resin, and the bag 4 is shrunk at regular intervals to each electronic part 1 having different size mounted to the PC board 2 of a circuit board 3 until a sealing resin 5 as a liquid is cured. The circuit board 3 is housed in the bag 4, the sealing resin 5 as the liquid is infected into the bag 4, the bag 4 is shrunk before the sealing resin 5 as the liquid is cured and solidified, and the circuit board 3 is sealed.
Inventors:
Osamu Murase
Takeo Okuda
Takeo Okuda
Application Number:
JP32878996A
Publication Date:
July 24, 2002
Filing Date:
December 09, 1996
Export Citation:
Assignee:
Tokai Rika Electric Co., Ltd.
International Classes:
H01L21/56; H01L23/28; H01L23/29; H01L23/31; H05K3/28; (IPC1-7): H01L21/56; H01L23/28; H01L23/29; H01L23/31
Domestic Patent References:
| JP3280923A | ||||
| JP5784117A | ||||
| JP56118232A | ||||
| JP63241987A | ||||
| JP63246853A | ||||
| JP585509A | ||||
| JP61182077A |
Attorney, Agent or Firm:
Hironobu Onda