Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR SEPARATING COMPOSITIONAL COMPONENT FROM SOLDER ALLOY
Document Type and Number:
Japanese Patent JP3960400
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a method for separating the compositional components from a solder alloy in which Pb is physically separated to recover from a solder alloy essentially consisting of Sn and Pb at a low cost.
SOLUTION: Molten Cu is filled into a vessel 1, or Cu is melted in the vessel 1, and a solder alloy composed of, by weight, 45 to 70% Sn, and the balance Pb is immersed into the molten Cu and is melted. Then, an alloy 3 of the molten Cu and the molten Sn is formed, the molten Pb is precipitated to separate on the bottom part of the vessel 1, and the Pb is physically separated to recover.


More Like This:
JP3093067INDUSTRIAL APPLICABILITY: Method and apparatus for removing zinc from galvanized steel sheet waste
WO/1994/026941METHOD AND EQUIPMENT FOR THERMOLYTIC VACUUM PROCESSING OF SOLID PRODUCTS, WITH CONTINUOUS SEPARATION AND RECOVERY OF A LIQUID FRACTION OF THESE PRODUCTS
JP2011001570METHOD FOR EXTRACTING NOBLE METAL COMPONENT IN ELECTRODE MATERIAL
Inventors:
Kawaguchi Toranosuke
Application Number:
JP3961098A
Publication Date:
August 15, 2007
Filing Date:
February 05, 1998
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Nippon Aluminum Co., Ltd.
International Classes:
C22B7/00; C22B13/02; (IPC1-7): C22B13/02; C22B7/00
Attorney, Agent or Firm:
Kazunori Saito



 
Previous Patent: ARRAY WAVEGUIDE GRATING ELEMENT

Next Patent: TOP PIVOT WITH ELECTROMAGNETIC LOCK FUNCTION