METHOD FOR STICKING ADHESIVE TAPE AND APPARATUS USING THE SAME

Title:

METHOD FOR STICKING ADHESIVE TAPE AND APPARATUS USING THE SAME

Document Type and Number:

Japanese Patent JP2006108503

Kind Code:

A

Abstract:

To provide an adhesive tape sticking method and an apparatus capable of accurately sticking an adhesive tape to a semiconductor wafer.

A protection tape supplied to the surface of a wafer W sucked and held by a holder is stuck to the surface of the wafer W while depressing the protection tape by a sticking roller, and simultaneously the surface height of the protection tape stuck to the surface of the wafer W is detected (step S3). The detection result is compared with a reference value of previously determined surface height (step S4). When both the values do not coincide with each other, the protection tape is peeled off, a foreign substance or the like existing on an interface between the wafer W and the adhesive surface is removed (step S5) and then a new protection tape is stuck to the surface of the wafer.

Inventors:

KUROOKA HIROAKI
SAKATA MASANORI
YAMAMOTO MASAYUKI

Application Number:

JP2004295194A

Publication Date:

April 20, 2006

Filing Date:

October 07, 2004

Export Citation:

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Assignee:

NITTO DENKO CORP
NITTO SEIKI KK

International Classes:

H01L21/683; H01L21/301; H01L21/304

Attorney, Agent or Firm:

Tsutomu Sugiya

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