Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR STICKING THIN FILM AND EXECUTING DEVICE THEREOF
Document Type and Number:
Japanese Patent JPH03147833
Kind Code:
A
Abstract:

PURPOSE: To prevent temporarily stuck film from being separated from board by a method wherein the tip sides of thin films under the condition being held or temporarily stuck onto the thin film sticking face sides of the board in the feeding direction of the film are brought close to pressure rollers by shifting board pinchingly guiding devices having the board pinched thereon.

CONSTITUTION: The tip side of each continuous laminate film 1B is sucked to each thin film feeding member 6, which is, after that, abutted against the thin film sticking face side at the tip of printed-wiring board carried to the predetermined position in the carrying direction of the board in order to temporarily stick the tip side of the continuous laminate film 1B. The laminate films 1B are pressed to the printed- wiring board 14 by vertically moving hot pressure rollers 11 and, after the release of the pinching of the board pinchingly guiding devices 16 and their retreat and through the rotation of the hot pressure rollers 11, the laminate films 1B are automatically fed so as to be stuck to the thin film sticking faces of the board from the tip part to the rear end part in the carrying direction of the board in order to prevent the laminate films 1B, which are temporarily stuck to the printed-wiring board 14, from being separated from the printed-wiring board 14.


Inventors:
SEKI MITSUHIRO
SUMI SHIGEO
GOTO TAKASHI
Application Number:
JP28772489A
Publication Date:
June 24, 1991
Filing Date:
November 04, 1989
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SOMAR CORP
International Classes:
B32B43/00; B29C65/00; B29C65/02; B29L9/00; H05K3/00; (IPC1-7): B29C65/00; B29L9/00; B32B35/00
Attorney, Agent or Firm:
Akita Aki