To provide a semiconductor device manufacturing technique that makes it possible to monitor all the device log information that each manufacturing device on a semiconductor device manufacturing line outputs to see if there is any failure in each individual device, thereby making it possible to detect any unknown failures that have no previous examples and to take measures against the failures of the manufacturing devices without causing product defects at the stage of completion of products.
A method for manufacturing the semiconductor device includes a step for acquiring the history data of the device log information of each target manufacturing device and performing a computing process on the history data to create a plurality of kinds of failure-determining threshold information for each kind of the device log information, and a step for collecting the device log information of the manufacturing devices and determining if each manufacturing device has failed in its process to machine a corresponding wafer, on the basis of the plurality of kinds of failure-determining threshold information created. The steps are repeated in a combination of predetermined cycles either for every process on a single wafer or for every process on a unit of the wafers combined.
TAMAOKI KENJI
NAKAJIMA MASAHIRO
YAMAMOTO KOJI
TOKOROZUKI KAZUYUKI
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